Chip Supplies
AZ 50XT Photoresist
2014-09-10 14:35:52
Positive resist for developing plating and wafer bumping applications
- 50 to 80 micron single coat capability. 120+micron double coat capability
- 3 to 1 aspect ratio. Excellent sidewall profiles. Wide process latitude
- Inorganic developer recommended
- Compatible with existing thick film processes
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100 Micron Copper studsAX 50XT 75 Micron Film Thickness
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100 Micron SnPb Studs AX 50XT 75 Micron Film Thickness
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FEATURES
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Excellent coating characteristics
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Excellent sidewall profiles
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Compatible with a wide variety of substrates
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Sensitive to g, h, and I-line
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wavelengths
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Stable
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Positive tone
BENEFITS
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Higher yields, reduced rework
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Straight plating profiles
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Works on Cu, Si, and Au
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substrates. Meets any application
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Fast photospeed. Works with popular steppers and contact aligners
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Wider process window
- Compatible with existing equipment and processes