Major Equipment
Bonding machine for rigid organic microfluidic chips
2015-02-05 13:47:12
Bonding machine for rigid organic chips was Wen Chang chip technologyindependently developed for PMMA, PC, hard plastics such as COC chipsealing, both at home and abroad the first hard plastic MicrofluidicChip processing equipment.
Product features:
Using the thermostatically controlled heating, precise temperaturecontrol, temperature sampling frequency is 0. 1 s；
Stainless steel working platform, the upper and lower surface is flat,fast thermal conductivity, thermal uniformity;
Large heating area, covering commonly used size chips;
Automatic cooling system water-cooled cooling, cooling rate uniformity,is used to get a better bonding effect;
Pressure manually adjustable pressure control for different materialswith different specifications.
Specifications:
Model: WH-2000
Dimension: L380mm * W330mm * H370mm
Weight: 30Kg
Bonding area: 200mm * 200mm
Heating temperature: 25-150 c
Heating rate: 25-110 c it takes about 10min
Cooling speed: 110-45 c it takes about 6min
Power: 1KW